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OSNA-Cu 58®:
Mechanical/Physical Properties
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Material comparison |
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OSNA-Cu 58® Te |
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OSNA-Cu 58® S |
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DIN EN 12164 - DIN EN 12166 -
DIN EN 12168 |
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CuTeP -CW 118C- |
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CuSP -CW 114C- |
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ASTM: (B 301) |
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C 14500 |
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C 14700 |
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OSNA-Cu 58® Te |
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OSNA-Cu 58® S |
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Cu-HCP |
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Softening temperature °C |
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~350 |
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~350 |
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~350 (Cu-ETP ~200) |
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Soft annealing temperature °C |
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450 - 600 |
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450 - 600 |
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450 - 600 |
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Cold forming properties |
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good |
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good |
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very good |
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Warm forming properties |
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good |
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good |
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very good |
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Cutting properties (mean)
machining brass = 100 |
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80 |
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70 |
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20 |
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Soft-soldering |
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very good |
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very good |
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very good |
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Hard-soldering1) |
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good |
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good |
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very good |
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Gas welding |
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bad |
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bad |
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very good |
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WIG welding |
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medium |
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medium |
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very good |
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MIG welding |
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bad |
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bad |
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very good |
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Resistance spot welding and
seam welding |
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bad |
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bad |
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bad |
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Resistance butt welding |
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regular |
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regular |
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very good |
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Corrosion resistance |
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as copper |
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OSNA-Cu 58® Te |
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OSNA-Cu 58® S |
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Cu-HCP |
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Density at 20°C |
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g/cm3 |
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8.9 |
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8.9 |
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8.9 |
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Melting point (liquidus) |
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°C |
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approx. 1.075 |
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approx. 1.075 |
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1.083 |
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Mean linear coefficient of expansion (average)
30 - 300°C |
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10-6/K |
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18.0 |
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18.0 |
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17.6 |
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Electrical conductivity 20°C
Soft state |
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MS/m |
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≥ 50
(86% IACS) |
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≥ 50
(86% IACS) |
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57
(98% IACS) |
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Reference values: |
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Heat conductivity
at 20°C |
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W/(m.K) |
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356 |
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356 |
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390 |
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Specific heat at 20°C |
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J/(kg.K) |
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380 |
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380 |
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380 |
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Young's modulus |
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MPa |
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120,000 |
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120,000 |
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120,000 |
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Modulus of torsion |
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MPa |
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41,000 |
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41,000 |
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39,000 |
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Magnetic behaviour |
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non-magnetic |
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non-magnetic |
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non-magnetic |
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1) Use special-quality for hard-soldering or ablate approx. 1 mm from diameter.
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