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OSNA-Cu 58®:
Mechanical/Physical Properties

Material comparison OSNA-Cu 58® Te OSNA-Cu 58® S
DIN EN 12164 - DIN EN 12166 -
DIN EN 12168
  CuTeP
-CW 118C-
CuSP
-CW 114C-
   
  ASTM: (B 301)   C 14500   C 14700      

 
          OSNA-Cu 58® Te OSNA-Cu 58® S   Cu-HCP  
Softening temperature °C       ~350   ~350   ~350 (Cu-ETP ~200)  
  Soft annealing temperature °C       450 - 600 450 - 600   450 - 600  
Cold forming properties   good good   very good
  Warm forming properties       good good   very good  
Cutting properties (mean)
machining brass = 100
  80 70   20
  Soft-soldering       very good   very good   very good  
Hard-soldering1)     good good very good
  Gas welding       bad   bad   very good  
WIG welding     medium medium very good
  MIG welding       bad   bad   very good  
Resistance spot welding and
seam welding
      bad bad   bad
  Resistance butt welding       regular   regular   very good  
Corrosion resistance as copper

OSNA-Cu 58® Te OSNA-Cu 58® S Cu-HCP
  Density at 20°C   g/cm3   8.9   8.9    8.9  
Melting point (liquidus) °C approx. 1.075 approx. 1.075 1.083
  Mean linear coefficient of
expansion (average)
30 - 300°C
  10-6/K   18.0   18.0    17.6  
Electrical conductivity 20°C
Soft state
MS/m ≥ 50
(86% IACS)
≥ 50
(86% IACS)
57
(98% IACS)
  Reference values:                      
Heat conductivity
at 20°C
W/(m.K) 356 356 390
  Specific heat at 20°C   J/(kg.K)   380   380   380  
Young's modulus MPa 120,000 120,000 120,000
  Modulus of torsion   MPa   41,000   41,000   39,000  
Magnetic behaviour non-magnetic non-magnetic non-magnetic

1) Use special-quality for hard-soldering or ablate approx. 1 mm from diameter.





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